Burnsville, MN

At Dimation, we are dedicated to providing our customers with he highest level of service possible. Understanding that time-to-market is extremely critical, we often make the difference between success and failure by providing Quick-Turn, Walk-In and Evening services to help you meet your customers’ deadline. Understanding we provide services to a wide variety of industries for the micro-packaging industry, we do that while placing a high value on performance, quality of service and career development. Dimation provides rewarding opportunities where we believe every individual we hire will make a difference, and we look forward to every new employee to become an essential part of the Dimation Team!

Dimation, Inc has an opening at our Burnsville, MN facility for a full-time Wire bond Technician. This position reports to the Die Level Services Manager and works closely with our Engineering, Quality and Production departments.

This position will be responsible for high level technology packaging requirements, which include COB assembly, Wafer Saw and Wire bonding operations. Other duties include programming, operation, and maintenance of K&S Maxum Ultra gold ball bonder. He/She will assist in development of all Die Level Services procedures used in prototype and production, as well as being responsible for ensuring that all products meet the highest level of quality and reflect Mil-STD 883 standards and practices. He/she will provide training in new procedures to Die Level Services staff, conduct failure analysis of wire bond failures, and provide support for all wire bond issues.

PRIMARY DUTIES/RESPONSIBILITIES:

• Understand general theory of Wire bonding and is able to make machine parameter adjustments in response to material plating performance issues that result in mis-bonds such as no-sticks, flame-offs, bond-pad discoloration, etc. to successfully complete wire bond operation
• Able to program basic wire bond programs, High Level multi Tier and exotic and leading edge technology creative bonding programs
• Conduct troubleshooting of wire bond failure root causes
• Work closely with Engineering and Sales to assure that customer’s requirements are properly met
• Work with Purchasing to resolve problems with Suppliers as pertaining to wire bonding

QUALIFICATIONS & SKILLS:

• Knowledge and experience of Chip on Board (COB), Chip on Flex (COF) and wire bonding technology
• Effective Communicator and enhanced skill set regarding present wire bond issues to both internal and external customers
• Posses strong Interpersonal and Teamwork skills to work effectively with all levels of staff
• Knowledge of basic electronics
• Knowledge of Microsoft Office, Excel and Word
• Able to read technical drawings
• Must be able to conform to ITAR requirements

BACKGROUND/EDUCATION:

• Technical education in Electronics or Electronics related area
• Five -plus years experience , specifically in the operation of wire bonding technology
• Experience with failure analysis of electronic assemblies and components a plus

PHYSICAL DEMANDS:

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

• Such duties require stand/sit at a wire bonder, wafer saw and or dispensing equipment.
• Frequently required to sit at a computer and use a keyboard and computer mouse
• May be required to lift or carry up to 20- 25 pounds
• Hand -to-eye operations requiring fine motor skills with precision accuracy (i.e. wire threading, tweezer work)

WORK ENVIRONMENT:

• Clean room / Lab environment - NO Getting Dirty Here!
• Minimum to Moderate noise level - Easy on the Ears
• Office environment - Friendly and Professional Staff
• ESD Controls - Only Shocking if not wearing
• May be required to work with chemicals - Majic Juice and Creative Etching
• Low Qty Prototype Job Service Requests - Variety and One Up
• High Pace, Responsive turn times - All Hands on Deck Mind Set