Seeking a PCB & Substrate Layout Engineer for a direct hire opportunity with our client in Phoenix, AZ.

This position offers a hybrid work schedule and full benefits including PTO, Medical, Dental and 401k, as well as bonus opportunities!

Salary is between $75,000 - 105,000 per year (based on experience)

Responsibilities:

• Support design, layout, and analysis of electrical and mechanical systems and their constituent parts including: high-density interposers, substrates, and printed circuit board (PCB) layouts. This includes power, digital, analog, and RF signals across multiple die (primarily flip-chip)
• Support high-speed, multi-layer packaging, high-density interconnects (HDI), blind and buried vias, ball grid arrays (BGAs), RF, design for test (DFT), impedance calculations, cross talk, differential pairs, PCB stack-ups, PCB via structures, electromagnetic compatibility (EMC), material studies/selection, etc.
• Knowledge of Design For Manufacturing rules of our suppliers and ensure design process matches their capabilities
• Knowledge of fabrication drawings that match the intent of the design and support the fabrication suppliers to ensure the technical intent is transferred successfully
• Support package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant
• Work with peers and the engineering team to review the artwork and drawings at different stages and at the final design review for fabrication and assembly
• Provide support for multidisciplinary investigations and feasibility studies with collaboration across engineering disciplines
• Provide support for interfacing to customers, subcontractors, assemblers, fabricators, consultants, and vendors/suppliers, operations, quality, supply chain, and supporting organizations
• Works on issues where analysis of situations or data requires an in-depth evaluation of variable factors

Qualifications:

• Bachelor's Degree in Engineering or equivalent education and experience required

• 3+ years as a PCB and/or High-Density Package Layout designer using industry standard layout tools like Cadence APD+

• HDI stack-ups, including use of blind & buried micro-vias, specialty RF dielectric materials, and trace width/spacing around 15um/15um down to 2um/2um or below
• Experience with 2.5D devices, interposer or substrate design, flip-chip, surface mount, die stacking, package stacking, substrate stacking and other techniques
• Experience using a Cadence schematic / netlist driven CAD layout process,
• Working knowledge of AutoCAD. Must be able to import, modify and export DXF PCB outline data
• Understanding of layout techniques in Digital, Analog, and/or RF layouts
• Knowledge of electronic packaging techniques
• Experience using a CAM package for manufacturing data validation. Knowledge of CAM350 & Blueprint is preferred
• Working knowledge of JEDEC /IPC design, fabrication, and assembly specifications
• Experience creating assembly documentation and fabrication deliverables per company and industry standards
• High-end FPGA package or board design experience

If you are interested in learning more about this role, please submit your resume for immediate consideration!

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